Paras Defence arm to set up ₹6,200 crore semiconductor packaging facility in Madhya Pradesh
The company has signed a memorandum of understanding (MoU) with the Ministry of Science and Technology, acting through MP State Electronics Development Corporation (MPSeDC), for the project.
Also Read: Indian Navy to add submarine hunter INS Malvan to its fleet: Check out its capabilities and why it matters
The proposed Outsourced Semiconductor Assembly and Testing (OSAT) facility will be located in the Indore-Ujjain region and will focus on advanced integrated circuit (IC) packaging technologies.
Following the announcement, shares of Paras Defense and Space Technologies fell 0.7% to an intraday low of ₹1,214.
Under the agreement, Paras Semiconductors and MPSeDC will collaborate by pooling their expertise and resources to facilitate the establishment of the project.
According to the company, the facility will undertake advanced packaging operations including 3D heterogeneous integration, 2.5D and 3D advanced packaging, hybrid compounding, ultra-high density spread packaging, chiplet integration, wafer impaction, flip-chip assembly, testing and reliability services.
The project is aimed to strengthen India’s semiconductor packaging capabilities as the country expands domestic electronics manufacturing and chip ecosystem.
